© 2017 Kingbright. All Rights Reserved. Spec No: DSAP0829 / 1203015592 Rev No: V.3B Date: 08/17/2017

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APFA3011-AK13/F

TECHNICAL DATA

PACKING & LABEL SPECIFICATIONS

REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS

Notes:

1. Don't cause stress to the LEDs while it is exposed to high temperature.

2. The maximum number of reflow soldering passes is 2 times.

3. Reflow soldering is recommended. Other soldering methods are not recommended as they might

cause damage to the product.

PRECAUTIONARY NOTES

1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.

2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to

the latest datasheet for the updated specifications.

3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If

customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.

4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening

liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.

5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.