Motor de Búsqueda de Datasheet de Componentes Electrónicos
  Spanish  ▼
ALLDATASHEET.ES

X  

74LVC1G86GW Datasheet(PDF) 10 Page - NXP Semiconductors

No. de pieza 74LVC1G86GW
Descripción Electrónicos  2-input EXCLUSIVE-OR gate
Download  12 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricante Electrónico  PHILIPS [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

74LVC1G86GW Datasheet(HTML) 10 Page - NXP Semiconductors

Back Button 74LVC1G86GW Datasheet HTML 4Page - NXP Semiconductors 74LVC1G86GW Datasheet HTML 5Page - NXP Semiconductors 74LVC1G86GW Datasheet HTML 6Page - NXP Semiconductors 74LVC1G86GW Datasheet HTML 7Page - NXP Semiconductors 74LVC1G86GW Datasheet HTML 8Page - NXP Semiconductors 74LVC1G86GW Datasheet HTML 9Page - NXP Semiconductors 74LVC1G86GW Datasheet HTML 10Page - NXP Semiconductors 74LVC1G86GW Datasheet HTML 11Page - NXP Semiconductors 74LVC1G86GW Datasheet HTML 12Page - NXP Semiconductors  
Zoom Inzoom in Zoom Outzoom out
 10 / 12 page
background image
2001 Apr 06
10
Philips Semiconductors
Preliminary specification
2-input EXCLUSIVE-OR gate
74LVC1G86
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not suitable(2)
suitable
PLCC(3), SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable


Número de pieza similar - 74LVC1G86GW

Fabricante ElectrónicoNo. de piezaDatasheetDescripción Electrónicos
logo
NXP Semiconductors
74LVC1G86GW PHILIPS-74LVC1G86GW Datasheet
86Kb / 15P
   2-input EXCLUSIVE-OR gate
2004 Sep 08
74LVC1G86GW NXP-74LVC1G86GW Datasheet
87Kb / 14P
   2-input EXCLUSIVE-OR gate
Rev. 06-18 July 2007
logo
Nexperia B.V. All right...
74LVC1G86GW NEXPERIA-74LVC1G86GW Datasheet
255Kb / 16P
   2-input EXCLUSIVE-OR gate
Rev. 13 - 7 January 2022
74LVC1G86GW-Q100 NEXPERIA-74LVC1G86GW-Q100 Datasheet
183Kb / 13P
   2-input EXCLUSIVE-OR gate
More results

Descripción similar - 74LVC1G86GW

Fabricante ElectrónicoNo. de piezaDatasheetDescripción Electrónicos
logo
NXP Semiconductors
74HC1G86GW.125 NXP-74HC1G86GW.125 Datasheet
77Kb / 11P
   2-input EXCLUSIVE-OR gate
Rev. 04-20 July 2007
logo
Unisonic Technologies
U74AHCT1G86 UTC-U74AHCT1G86 Datasheet
101Kb / 4P
   2-INPUT EXCLUSIVE-OR GATE
logo
National Semiconductor ...
54F86DM NSC-54F86DM Datasheet
137Kb / 6P
   2-Input Exclusive-OR Gate
logo
NXP Semiconductors
74AHC1G86 PHILIPS-74AHC1G86 Datasheet
61Kb / 12P
   2-input EXCLUSIVE-OR gate
2002 Jun 06
logo
Renesas Technology Corp
RD74LVC1G86 RENESAS-RD74LVC1G86 Datasheet
2Mb / 8P
   2-input Exclusive OR Gate
logo
Hitachi Semiconductor
HD74ALVC1G86 HITACHI-HD74ALVC1G86 Datasheet
37Kb / 10P
   2-input Exclusive-OR Gate
logo
NXP Semiconductors
74HC1G86 PHILIPS-74HC1G86 Datasheet
78Kb / 12P
   2-input EXCLUSIVE-OR gate
1998 Aug 05
74HC1G86 NXP-74HC1G86 Datasheet
77Kb / 11P
   2-input EXCLUSIVE-OR gate
Rev. 04-20 July 2007
74LVC1G86 NXP-74LVC1G86 Datasheet
87Kb / 14P
   2-input EXCLUSIVE-OR gate
Rev. 06-18 July 2007
logo
Renesas Technology Corp
HD74LV1G86A RENESAS-HD74LV1G86A_08 Datasheet
110Kb / 8P
   2-input Exclusive-OR Gate
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12


Datasheet Descarga

Go To PDF Page


Enlace URL




Política de Privacidad
ALLDATASHEET.ES
¿ALLDATASHEET es útil para Ud.?  [ DONATE ] 

Todo acerca de Alldatasheet   |   Publicidad   |   Contáctenos   |   Política de Privacidad   |   Intercambio de Enlaces   |   Lista de Fabricantes
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com