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LTM4633 Datasheet(PDF) 17 Page - Linear Technology |
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LTM4633 Datasheet(HTML) 17 Page - Linear Technology |
17 / 32 page LTM4633 17 4633f For more information www.linear.com/LTM4633 applicaTions inForMaTion ensure the voltage at CNTL_PWR is always greater than the voltage at EXTVCCatalltimesincludingduringstart-up and shutdown. Connecting VOUT3 to EXTVCC may present a convenient way to meet the sequencing requirement if VOUT3 is a 5V output. Otherwise float EXTVCC if not used. Thermal Considerations and Output Current Derating The thermal resistances reported in the Pin Configura- tion section of the data sheet are consistent with those parameters defined by JESD 51-12 and are intended for use with finite element analysis (FEA) software modeling tools that leverage the outcome of thermal modeling, simulation, and correlation to hardware evaluation per- formed on a µModule package mounted to a hardware test board defined by JESD 51-9 (“Test Boards for Area Array Surface Mount Package Thermal Measurements”). The motivation for providing these thermal coefficients is found in JESD 51-12 (“Guidelines for Reporting and Using Electronic Package Thermal Information”). Many designers in lieu or to compliment any FEA activities may opt to use laboratory equipment and a test vehicle such as the demo board to anticipate the µModule regula- tor’s thermal performance in their application at various electricalandenvironmentaloperatingconditions.Without FEA software, the thermal resistances reported in the Pin Configurationsectionarein-and-ofthemselvesnotrelevant toprovidingguidanceofthermalperformance;instead,the deratingcurvesprovidedlaterinthedatasheetcanbeused in a manner that yields insight and guidance pertaining to one’s application usage, and can be adapted to correlate thermal performance to one’s own application. The Pin Configuration section provides values based on four thermal coefficients explicitly defined in JESD 51-12; these coefficients are quoted or paraphrased: 1. θJA:Thethermalresistancefromjunctiontoambient,is the natural convection junction-to-ambient air thermal resistance measured in a one cubic foot sealed enclo- sure. This environment is sometimes referred to as “still air” although natural convection causes the air to move.Thisvalueisdeterminedwiththepartmountedto a JESD 51-9 defined test board, which does not reflect an actual application or viable operating condition. 2. θJCbottom: The thermal resistance from the junction to the bottom of the product case, is determined with all of the internal power dissipation flowing through the bottom of the package. In a typical µModule regulator, the bulk of the heat flows out the bottom of the pack- age, but there is always heat flow out into the ambient environment. As a result, this thermal resistance value may be useful for comparing packages but the test conditions don’t generally match the user’s application. 3. θJCtop: The thermal resistance from junction to top of the product case, is determined with nearly all of the componentpowerdissipationflowingthroughthetopof the package. As the electrical connections of the typical µModule regulator are on the bottom of the package, it is rare for an application to operate such that most of the heat flows from the junction to the top of the part. As in the case of θJCbottom, this value may be useful for comparing packages but the test conditions don’t generally match the user’s application. 4. θJB: The thermal resistance from junction to the printed circuitboard,isthejunction-to-boardthermalresistance where almost all of the heat flows through the bottom of the µModule package and into the board, and is really the sum of the θJCbottom and the thermal resistance of the bottom of the part through the solder joints and through a portion of the board. The board temperature is measured at a specified distance from the package, using a 2-sided, 2-layer board. This board is described in JESD 51-9. |
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