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BUK7608-55A Datasheet(PDF) 4 Page - NXP Semiconductors |
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BUK7608-55A Datasheet(HTML) 4 Page - NXP Semiconductors |
4 / 14 page Philips Semiconductors BUK7508-55A; BUK7608-55A TrenchMOS™ standard level FET Product data Rev. 02 — 17 January 2002 4 of 14 9397 750 09091 © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 7. Thermal characteristics 7.1 Transient thermal impedance Table 4: Thermal characteristics Symbol Parameter Conditions Value Unit Rth(j-a) thermal resistance from junction to ambient vertical in still air; SOT78 package 60 K/W mounted on printed circuit board; minimum footprint; SOT404 package 50 K/W Rth(j-mb) thermal resistance from junction to mounting base Figure 4 0.59 K/W Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration. 03nh49 Single Shot 0.2 0.1 0.05 0.02 10-3 10-2 10-1 1 10-6 10-5 10-4 10-3 10-2 10-1 1 tp (s) Zth(j-mb) (K/W) δ = 0.5 tp tp T P t T δ = |
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