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STP40N20 Datasheet(PDF) 2 Page - STMicroelectronics |
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STP40N20 Datasheet(HTML) 2 Page - STMicroelectronics |
2 / 13 page STB40N20 - STP40N20 - STW40N20 2/13 Table 3: Absolute Maximum ratings ( ) Pulse width limited by safe operating area (1) ISD ≤ 40A, di/dt ≤ 200 A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX. Table 4: Thermal Data Table 5: Avalanche Characteristics Symbol Parameter Value Unit VDS Drain-source Voltage (VGS = 0) 200 V VDGR Drain-gate Voltage (RGS = 20 kΩ)200 V VGS Gate- source Voltage ± 20 V ID Drain Current (continuous) at TC = 25°C 40 A ID Drain Current (continuous) at TC = 100°C 25 A IDM ( ) Drain Current (pulsed) 160 A PTOT Total Dissipation at TC = 25°C 160 W Derating Factor 1.28 W/°C dv/dt (1) Peak Diode Recovery voltage slope 12 V/ns Tj Tstg Operating Junction Temperature Storage Temperature -55 to 150 °C TO-220/ TO-247 Rthj-case Thermal Resistance Junction-case Max 0.78 °C/W Rthj-amb Thermal Resistance Junction-ambient Max 62.5 50 °C/W Tl Maximum Lead Temperature For Soldering Purpose 300 °C Symbol Parameter Max Value Unit IAR Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by Tj max) 40 A EAS Single Pulse Avalanche Energy (starting Tj = 25 °C, ID = IAR, VDD = 50 V) 230 mJ |
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