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PHILIPS |
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3 page
9397 750 13966 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data sheet Rev. 05 — 24 November 2004 3 of 9 Philips Semiconductors PIMZ2; PUMZ2 NPN/PNP general-purpose double transistors 5. Limiting values [1] Device mounted on an FR4 printed-circuit board. 6. Thermal characteristics [1] Device mounted on an FR4 printed-circuit board. Table 6: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per transistor; for the PNP transistor with negative polarity VCBO collector-base voltage open emitter - 60 V VCEO collector-emitter voltage open base - 50 V VEBO emitter-base voltage open collector - 7 V IC collector current (DC) - 150 mA ICM peak collector current - 200 mA IBM peak base current - 100 mA Ptot total power dissipation Tamb ≤ 25 °C SOT457 [1] - 200 mW SOT363 [1] - 180 mW Tstg storage temperature −65 +150 °C Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Per device Ptot total power dissipation Tamb ≤ 25 °C SOT457 [1] - 300 mW SOT363 [1] - 300 mW Table 7: Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per transistor Rth(j-a) thermal resistance from junction to ambient Tamb ≤ 25 °C SOT457 [1] - - 625 K/W SOT363 [1] - - 694 K/W Per device Rth(j-a) thermal resistance from junction to ambient Tamb ≤ 25 °C SOT457 [1] - - 417 K/W SOT363 [1] - - 417 K/W |
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