HCPL-814 datasheet(3/6 Pages) HP | AC Input Phototransistor Optocoupler High Density Mounting Type

3 page

HCPL-814-300E

Solder Reflow Temperature Profile

1) One-time soldering reflow is

recommended within the

condition of temperature and

time profile shown at right.

2) When using another soldering

method such as infrared ray

lamp, the temperature may rise

partially in the mold of the

device. Keep the temperature on

the package of the device within

the condition of (1) above.

30 seconds

60 ~ 150 sec

90 sec

60 sec

°C

150

°C

200

°C

250

°C

260

°C (Peak Temperature)

217

°C

Time (sec)

Absolute Maximum Ratings

Parameters

Symbol

Min.

Max.

Units

Storage Temperature

–55

125

˚C

Ambient Operating Temperature

–30

100

˚C

Lead Solder Temperature for 10s

Tsol

260

˚C

(1.6 mm below seating plane)

Average Forward Current

±50

Input Power Dissipation

Collector Current

Collector-Emitter Voltage

VCEO

Emitter-Collector Voltage

VECO

Collector Power Dissipation

150

Total Power Dissipation

Ptot

200

Isolation Voltage

Viso

5000

Vrms

(AC for 1 minute, R.H. = 40 ~ 60%)[1]

6.5

± 0.5

(0.256)

DIMENSIONS IN MILLIMETERS AND (INCHES)

4.6

± 0.5

(0.181)

2.54

± 0.25

(0.1)

3.5

± 0.5

(0.138)

7.62

± 0.3

(0.3)

0.26

(0.010)

10.16

± 0.3

(0.4)

1.2

± 0.1

(0.047)

0.35

± 0.25

(0.014)

1.0

± 0.25

(0.039)

A 814

YW W

DATE CODE *1

RANK *2

LEAD FREE

ANODE

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