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SI7220DN Datasheet(PDF) 1 Page - Vishay Siliconix |
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SI7220DN Datasheet(HTML) 1 Page - Vishay Siliconix |
1 / 5 page FEATURES D TrenchFETr Power MOSFET D New Low Thermal Resistance PowerPAKr Package, 1/3 the Space of An SO-8 While Thermally Comparable APPLICATIONS D Synchronous Rectification D Primary Side Switch RoHS COMPLIANT Si7220DN Vishay Siliconix Document Number: 73117 S-51128—Rev. B, 13-Jun-05 www.vishay.com 1 Dual N-Channel 60-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) rDS(on) (W) ID (A) Qg (Typ) 60 0.060 @ VGS = 10 V 4.8 13 60 0.075 @ VGS = 4.5 V 4.3 13 PowerPAK 1212-8 Bottom View 1 2 3 4 5 6 7 8 S1 G1 S2 G2 D1 D1 D2 D2 3.30 mm 3.30 mm Ordering Information: Si7220DN-T1—E3 (Lead (Pb)-Free) N-Channel MOSFET G1 D1 S1 N-Channel MOSFET G2 D2 S2 ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED) Parameter Symbol 10 secs Steady State Unit Drain-Source Voltage VDS 60 V Gate-Source Voltage VGS "20 V Continuous Drain Current (TJ = 150_C)a TA = 25_C ID 4.8 3.4 Continuous Drain Current (TJ = 150_C)a TA = 70_C ID 3.8 2.7 A Pulsed Drain Current IDM 20 A Avalanche Current L = 0 1 mH IAS 11 Single Avalanche Energy L = 0.1 mH EAS 6.1 mJ Continuous Source Current (Diode Conduction)a IS 2.2 1.1 A Maximum Power Dissipationa TA = 25_C PD 2.6 1.3 W Maximum Power Dissipationa TA = 70_C PD 1.4 0.69 W Operating Junction and Storage Temperature Range TJ, Tstg −55 to 150 _C Soldering Recommendations (Peak Temperature)b,c 260 _C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Mi J ti t A bi ta t v 10 sec R 38 48 Maximum Junction-to-Ambienta Steady State RthJA 77 94 _C/W Maximum Junction-to-Case (Drain) Steady State RthJC 4.3 5.4 C/W Notes a. Surface Mounted on 1” x 1” FR4 Board. b. See Solder Profile (http://www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. |
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