Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

www.eaton.com/electronics

© 2017 Eaton

All Rights Reserved Printed in USA

Publication No. 4315 BU-SB14112

September 2017

Eaton is a registered trademark.

All other trademarks are property

of their respective owners.

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly

used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also

reserves the right to change or update, without notice, any technical information contained in this bulletin.

Solder Reflow Profile

t

Time 25°C to Peak

Time

25°C

Preheat

A

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

TTaabbllee 1

1 -- S

Sttaannddaarrdd S

SnnP

Pbb S

Soollddeerr ((TTcc))

Volume

Volume

Package

mm

3

mm

3

Thickness

<350

_

>350

<2.5mm

235°C

220°C

_

>2.5mm

220°C

220°C

TTaabbllee 2

2 -- LLeeaadd ((P

Pbb)) FFrreeee S

Soollddeerr ((TTcc))

Volume

Volume

Volume

Package

mm

3

mm

3

mm

3

Thickness

<350

350 - 2000

>2000

<1.6mm

260°C

260°C

260°C

1.6 – 2.5mm 260°C

250°C

245°C

>2.5mm

250°C

245°C

245°C

Reference JDEC J-STD-020

Standard SnPb Solder

Lead (Pb) Free Solder

Profile Feature

Preheat and Soak• e

T mperature min. (Tsmin)

100°C

150°C

• Temperature max. (Tsmax)

150°C

200°C

• Time (Tsmin to Tsmax) (ts)

60-120 Seconds

60-120 Seconds

3°C/ Second Max.

3°C/ Second Max.

183°C

217°C

60-150 Seconds

60-150 Seconds

Table 1

able 2

T

20 Seconds**

30 Seconds**

6°C/ Second Max.

6°C/ Second Max.

Average ramp up rate Tsmax to Tp

Time at liquidous (tL)

Peak package body temperature (TP)*

Time (tp)** within 5 °C of the specified classification temperature (Tc)

Average ramp-down rate (Tp to Tsmax)

Time 25°C to Peak Temperature

Minutes Max.

6

8 Minutes Max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Technical Data 4315

Effective September 2017

DR

High power density, high efficiency, shielded drum core power inductors