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GD5F1GQ4UFZIS Datasheet(PDF) 57 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD5F1GQ4UFZIS Datasheet(HTML) 57 Page - GigaDevice Semiconductor (Beijing) Inc. |
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57 / 59 page  SPI(x1/x2/x4) NAND Flash 1G 57 23 REVISION HISTORY Version No Description Date Page AGE 1. Initial Release 2. Add RESET function description with ch13.2 3. Add RESET# pin on Connection Diagram ch3.2 4. Update read ID/UID/CID/parameter page on ch10. 2017-06-14 1.1 Add parameter page CRC value 2017-07-14 1.2 Modify Package WSON8 (6*8mm) 2017-07-20 1.3 Modify the Number of Figure and Table Modify Package ‘R’ description Reduce the size of parameter page device model table Modify Read CID command sequence description Add automatically read first page of fist block to cache after RESET (FFH) 2017-09-01 1.4 Add the Note article 4 of Page Program 2017-10-23 1.5 Add the chapter of Valid Part Numbers 2017-11-03 1.6 Add the description of 1Gb SLC NAND Flash Add the description of Reliability Delete Valid Part Number of GD5F1GQ4UF9IG Modify the Figure of Program Load Sequence Diagram typo Modify the package of LGA8 2017-12-11 1.7 Modify the package of WSON8,SOP16 300mil,TFBGA24 Modify the typo of LGA8 Dec.27.2017 1.8 Add LGA8 package description for hardware reset section 2018-1-16 1.9 Modify some typo Add Temperature Range J:Industrial(-40 ℃ to 105℃) and related description Change Memory Mapping CA from<12:0> to <11:0> Add byte1 and byte2 for two Device ID in Read Sequence Diagram Add page size 2048bytes + 64bytes with ECC enabled Modify figures11-1,11-2,11-4,11-5,11-6 from Byte 2175 to 2175/2111 and add a note to explain Change Parameter page table Byte 105-106 and 108-109,and change CRC Value Merge chapters 2.1 and 21.1 Change the description of protection with WP# Pin 2018-2-13 2.0 Add Temperature Range F:Industrial+ (-40 ℃ to 85℃) 2018-3-12 2.1 Modify the Value of Applied Input/ Output Voltage and VCC in Chapter16 Modify the description of LGA8 6*8mm package Update Ordering Information 2018-7-25 2.2 Modify the file name 2018-10-22 |
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