BAS40−04LT1

http://onsemi.com

4

PACKAGE DIMENSIONS

CASE 318−08

ISSUE AH

SOT−23 (TO−236AB)

DIM

A

MIN

MAX

MIN

MAX

MILLIMETERS

0.1102 0.1197

2.80

3.04

INCHES

B 0.0472 0.0551

1.20

1.40

C 0.0385 0.0498

0.99

1.26

D 0.0140 0.0200

0.36

0.50

G 0.0670 0.0826

1.70

2.10

H 0.0040 0.0098

0.10

0.25

J 0.0034 0.0070

0.085

0.177

K 0.0180 0.0236

0.45

0.60

L 0.0350 0.0401

0.89

1.02

S 0.0830 0.0984

2.10

2.50

V 0.0177 0.0236

0.45

0.60

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD THICKNESS

IS THE MINIMUM THICKNESS OF BASE

MATERIAL.

4. 318−01, −02, AND −06 OBSOLETE, NEW

STANDARD 318−09.

1

3

2

A

L

BS

V

G

D

H

C

K

J

STYLE 11:

PIN 1. ANODE

2. CATHODE

3. CATHODE−ANODE

SOT−123

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

mm

inches

SCALE 10:1

0.8

0.031

0.9

0.035

0.95

0.037

0.95

0.037

2.0

0.079

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