MC100LVEL31 datasheet(3/4 Pages) ONSEMI

No. de pieza	MC100LVEL31

Descripción Electrónicos	D Flip-Flop With Set and Reset

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Fabricante Electrónico	ONSEMI [ON Semiconductor]

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3 / 4 page

MC100LVEL31

3–3

MOTOROLA

ECLinPS and ECLinPS Lite

DL140 — Rev 3

OUTLINE DIMENSIONS

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751–05

ISSUE P

SEATING

PLANE

1

4

5

8

A

0.25 (0.010) M TB SS

8X

D

M

J

_

–A–

–B–

–T–

DIM

MIN

MAX

MILLIMETERS

A

4.80

5.00

B

3.80

4.00

C

1.35

1.75

D

0.35

0.49

F

0.40

1.25

G

1.27 BSC

J

0.18

0.25

K

0.10

0.25

M

0

7

P

5.80

6.20

R

0.25

0.50

_

G

NOTES:

1. DIMENSIONS A AND B ARE DATUMS AND T IS A

DATUM SURFACE.

2. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

3. DIMENSIONS ARE IN MILLIMETER.

4. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

6. DIMENSION D DOES NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS

OF THE D DIMENSION AT MAXIMUM MATERIAL

CONDITION.

Número de pieza similar - MC100LVEL31

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
ON Semiconductor	MC100LVEL31	136Kb / 8P	3.3V ECL D Flip-Flop with Set and Reset December, 2006 ??Rev. 3
	MC100LVEL31D	136Kb / 8P	3.3V ECL D Flip-Flop with Set and Reset December, 2006 ??Rev. 3
	MC100LVEL31D	202Kb / 20P	Evaluation Board Manual for High Frequency SOIC 8 August, 2004 ??Rev. 1
	MC100LVEL31DG	136Kb / 8P	3.3V ECL D Flip-Flop with Set and Reset December, 2006 ??Rev. 3
	MC100LVEL31DG	152Kb / 6P	3.3 V ECL D Flip?륡lop with Set and Reset July, 2016 ??Rev. 5

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Descripción similar - MC100LVEL31

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MC100LVEL31 Datasheet(PDF) 3 Page - ON Semiconductor

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