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MC100LVEP111 Datasheet(PDF) 7 Page - ON Semiconductor |
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MC100LVEP111 Datasheet(HTML) 7 Page - ON Semiconductor |
7 / 8 page MC100LVEP111 http://onsemi.com 7 Table 9. AC CHARACTERISTICS VCC = 0 V; VEE = −2.375 to −3.8 V or VCC = 2.375 to 3.8 V; VEE = 0 V (Note 14) Symbol −40°C 25°C 85°C Unit Characteristic Min Typ Max Min Typ Max Min Typ Max fmaxPECL/HSTL Maximum Frequency (Figure 4) 3 3 3 GHz tPLH tPHL Propagation Delay (Differential Configuration) 325 400 475 350 430 500 375 510 590 ps tskew Within−Device Skew (Note 15) Within−Device Skew @ 2.5 V (Note 15) Device−to−Device Skew (Note 16) 20 20 85 25 25 150 20 20 85 25 25 150 25 20 85 35 25 150 ps tJITTER CLOCK Random Jitter (RMS) @ v0.5 GHz @ v1.0 GHz @ v1.5 GHz @ v2.0 GHz @ v2.5 GHz @ v3.0 GHz 0.209 0.200 0.197 0.220 0.232 0.348 0.5 0.5 0.4 0.5 0.4 0.6 0.204 0.214 0.213 0.224 0.290 0.545 0.5 0.6 0.5 0.5 0.5 0.8 0.221 0.229 0.243 0.292 0.522 0.911 0.5 0.5 0.4 0.6 0.8 1.3 ps VPP Input Swing (Differential Interconnect Configuration) Measured Single−Ended 150 800 1200 150 800 1200 150 800 1200 mV tr/tf Output Rise/Fall Time (20%−80%) 105 200 255 125 200 275 150 230 320 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 14.Measured with 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V. 15.Skew is measured between outputs under identical transitions and conditions on any one device. 16.Device−to−Device skew for identical transitions at identical VCC levels. 0 100 200 300 400 500 600 700 800 0 1000 2000 3000 4000 5000 6000 Figure 4. Fmax Typical FREQUENCY (MHz) |
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