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5 page 
MC10EP105 http://onsemi.com 5 PACKAGE DIMENSIONS TQFP FA SUFFIX 32–LEAD PLASTIC PACKAGE CASE 873A–02 ISSUE A DETAIL Y A S1 V B 1 8 9 17 25 32 AE AE P DETAIL Y BASE N J D F METAL SECTION AE–AE G SEATING PLANE R Q _ W K X E C H DETAIL AD NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED AT DATUM PLANE –AB–. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE –AC–. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE –AB–. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.520 (0.020). 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003). 9. EXACT SHAPE OF EACH CORNER MAY VARY FROM DEPICTION. DIM A MIN MAX MIN MAX INCHES 7.000 BSC 0.276 BSC MILLIMETERS B 7.000 BSC 0.276 BSC C 1.400 1.600 0.055 0.063 D 0.300 0.450 0.012 0.018 E 1.350 1.450 0.053 0.057 F 0.300 0.400 0.012 0.016 G 0.800 BSC 0.031 BSC H 0.050 0.150 0.002 0.006 J 0.090 0.200 0.004 0.008 K 0.500 0.700 0.020 0.028 M 12 REF 12 REF N 0.090 0.160 0.004 0.006 P 0.400 BSC 0.016 BSC Q 1 5 1 5 R 0.150 0.250 0.006 0.010 V 9.000 BSC 0.354 BSC V1 4.500 BSC 0.177 BSC __ __ _ _ DETAIL AD A1 B1 V1 4X S 4X B1 3.500 BSC 0.138 BSC A1 3.500 BSC 0.138 BSC S 9.000 BSC 0.354 BSC S1 4.500 BSC 0.177 BSC W 0.200 REF 0.008 REF X 1.000 REF 0.039 REF 9 –T– –Z– –U– T–U 0.20 (0.008) Z AC T–U 0.20 (0.008) Z AB 0.10 (0.004) AC –AC– –AB– M _ 8X |
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