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ATL431LI_V02 Datasheet(Hoja de datos) 26 Page - Texas Instruments

No. de Pieza. ATL431LI_V02
Descripción  ATL431LI / ATL432LI High Bandwidth Low-Iq Programmable Shunt Regulator
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Fabricante  TI1 [Texas Instruments]
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Copyright © 2017–2019, Texas Instruments Incorporated
13.4 Thermal Considerations
The thermal performance of the ATL431LI will depend on the power dissipation, thermal resistance, and ambient
temperature. The ability to remove heat from the die is different for each package type, presenting different
considerations in the printed-circuit-board (PCB) layout. The PCB area around the device that is free of other
components moves the heat from the device to the ambient air. Performance data for JEDEC thermal metrics are
given in the Specifications table.
Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of
the output current and the voltage drop across the output pass element. For a ATL431LI, the pass element
voltage drop will be across the cathode and anode as shown in Equation 5. In certain packages, like the DQN
package, the thermal metrics will vary with how the thermal pad is connected. The DQN package is designed to
be soldered to a thermal pad on the board. It is reccomended that the DQN thermal pad is conencted to a
thermal dissipative section of the PCB if the ATL431LI in DQN package is expected to dissipate a significant
amount of power. It is reccomended to use large biasing resistors to keep the cathode current low on the
ATL431LI for better thermal performance. For more information on designing and manufacturing with DQN, see
Texas Instruments literature number SLUA271 and SCEA055. For reliable operation, limit junction temperature to
125°C (maximum) or its respective temperature maximum from the Reccomended Operating Conditions.

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