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DAC53401_V01 Datasheet(Hoja de datos) 4 Page - Texas Instruments

No. de Pieza. DAC53401_V01
Descripción  DACx3401 10-Bit and 8-Bit, Voltage-Output Digital-to-Analog Converters With Nonvolatile Memory and PMBus™ Compatible I2C Interface in Tiny 2 × 2 WSON
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Fabricante  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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4
DAC53401, DAC43401
SLASES7 – JULY 2019
www.ti.com
Product Folder Links: DAC53401 DAC43401
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Copyright © 2019, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VDD
Supply voltage, VDD to AGND
–0.3
6
V
Digital input(s) to AGND
–0.3
VDD + 0.3
V
CAP to AGND
–0.3
1.65
V
VFB to AGND
–0.3
VDD + 0.3
VOUT to AGND
–0.3
VDD + 0.3
Current into any pin
–10
10
mA
TJ
Junction temperature
–40
150
°C
Tstg
Storage temperature
–65
150
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
±2000
V
Charged device model (CDM), per JEDEC specification JESD22-C101,
pins 1, 4, 5, 8(2)
±750
Charged device model (CDM), per JEDEC specification JESD22-C101,
pins 2, 3, 6, 7(2)
±500
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX UNIT
VDD
Positive supply voltage to ground (AGND)
1.71
5.5
V
VIH
Digital input high voltage, 1.7 V < VDD ≤ 5.5 V
1.62
V
VIL
Digital input low voltage
0.4
V
TA
Ambient temperature
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.4 Thermal Information
THERMAL METRIC(1)
DACx3401
UNIT
DSG (WSON)
8 PINS
RθJA
Junction-to-ambient thermal resistance
49
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
50
°C/W
RθJB
Junction-to-board thermal resistance
24.1
°C/W
ΨJT
Junction-to-top characterization parameter
1.1
°C/W
ΨJB
Junction-to-board characterization parameter
24.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
8.7
°C/W




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