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DLPC900_V01 Datasheet(Hoja de datos) 24 Page - Texas Instruments

No. de Pieza. DLPC900_V01
Descripción  DLPC900 Digital Controller for Advanced Light Control
Descarga  83 Pages
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Fabricante  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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 24 page
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24
DLPC900
DLPS037D – OCTOBER 2014 – REVISED MARCH 2019
www.ti.com
Product Folder Links: DLPC900
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Copyright © 2014–2019, Texas Instruments Incorporated
(1)
The number inside the parentheses for the I/O refers to the I/O type defined in Table 1.
(2)
Assumes minimum 1 m/s airflow.
(3)
Maximum thermal values assume max power of 4.76 W (total for controller).
(4)
Assume φJT equals 0.4°C/W.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted). The functional performance of the device specified in this
data sheet is achieved when operating the device by the Recommended Operating Conditions. No level of performance is
implied when operating the device above or below the Recommended Operating Conditions limits.
I/O (1)
MIN
NOM
MAX
UNIT
VDD33
3.3 V supply voltage, I/O
3.135
3.3
3.465
V
VDD18
1.8 V supply voltage, LVDSAVD and
DRAMVDD
1.71
1.8
1.89
VDDC
1.15 V supply voltage, Core logic
1.100
1.15
1.200
PLLD_VDD
1.8 V supply voltage, PLL analog
1.71
1.8
1.89
PLLM1_VDD
1.8 V supply voltage, PLL analog
1.71
1.8
1.89
PLLM2_VDD
1.8 V supply voltage, PLL analog
1.71
1.8
1.89
PLLS_VDD
1.15 V supply voltage, PLL analog
1.090
1.15
1.200
PLLD_VDD
1.15 V supply voltage, PLL digital
1.090
1.15
1.200
PLLM1_VDD
1.15 V supply voltage, PLL digital
1.090
1.15
1.200
PLLM2_VDD
1.15 V supply voltage, PLL digital
1.090
1.15
1.200
VI
Input voltage
USB (9)
0
VDD33
V
OSC (10)
0
VDD33
3.3 V LVTTL (1, 2, 3, 4)
0
VDD33
3.3 V I2C (8)
0
VDD33
VO
Output voltage
USB (8)
0
VDD33
V
3.3 V LVTTL (1, 2, 3, 4)
0
VDD33
3.3 V I2C (8)
0
VDD33
1.8 V LVDS (7)
0
VDD18
TA
Operating ambient temperature range
See (2) and (3)
0
55
°C
TC
Operating top-center case temperature
See (3) and (4)
0
109.16
°C
TJ
Operating junction temperature
0
111
°C
(1)
RθJC analysis assumptions: The heat generated in the chip flows into overmold (top side) and also into the package laminate (bottom
side) and then into PCB via package solder balls. Should be used for heat sink analysis only.
(2)
Thermal coefficients abide by JEDEC Standard 51. RθJA is the thermal resistance of the package as measured using a JEDEC defined
standard test PCB. This JEDEC test PCB is not necessarily representative of the DLPC900 PCB and thus the reported thermal
resistance may not be accurate in the actual product application. Although the actual thermal resistance may be different, it is the best
information available during the design phase to estimate thermal performance.
(3)
Example: (3.2 W) × (0.4 C/W)
≈ 1.28°C temperature rise.
6.4 Thermal Information
THERMAL METRIC
DLPC900
UNIT
ZPC (BGA)
516 PINS
RθJC
(1)
Junction-to-case thermal resistance
4.4
°C/W
RθJA at 0 m/s of forced airflow
(2)
Junction-to-air thermal resistance
14.4
°C/W
RθJA at 1 m/s of forced airflow
(2)
Junction-to-air thermal resistance
9.5
°C/W
RθJA at 2 m/s of forced airflow
(2)
Junction-to-air thermal resistance
9.0
°C/W
φJT
(3)
Temperature variance from junction to package top center
temperature, per unit power dissipation
0.4
°C/W




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