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DLPC900_V01 Datasheet(Hoja de datos) 45 Page - Texas Instruments

No. de Pieza. DLPC900_V01
Descripción  DLPC900 Digital Controller for Advanced Light Control
Descarga  83 Pages
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Fabricante  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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 45 page
background image
Bootloader
Firmware
0xF9000000
0xF9FFFFFF
Boot Flash
CS1
Images
0xFA000000
CS2
Images
0xFAFFFFFF
0xFAF00000
Reserved
Bootloader
Firmware
0xF9000000
Boot Flash
CS1
Images
0xF9FFFFFF
0xF9F00000
Reserved
45
DLPC900
www.ti.com
DLPS037D – OCTOBER 2014 – REVISED MARCH 2019
Product Folder Links: DLPC900
Submit Documentation Feedback
Copyright © 2014–2019, Texas Instruments Incorporated
Figure 23. One 16-Mbit Flash Memory
When the memory requirement is greater than 16 Mbit but less than 32 Mbit, then two 16-Mbit flash components
can be used as shown in Figure 24. Use CS1 and CS2 when using only two flash components.
Figure 24. Two 16-Mbit Flash Memory Components
When memory requirement exceeds 32 Mbit, use the flash memory space shown in Figure 20. Notice that in all
examples, there is a 1-Mbit space reserved at the end of the memory space. The default and maximum size of
this reserved space is 1 Mbit; however, depending on the operating mode, the reserved space is customizable
and can be reduced by the design engineer when configuring the firmware. Whatever size is chosen, this
reserved area must be taken into consideration when calculating the required amount of memory.
7.3.5.5 Minimizing Board Size
Reducing the number of flash components saves valuable board area and reduces the cost of the PCB. There
are two additional ways to reduce cost: package selection and using larger density flash.
7.3.5.5.1
Package Selection
The first way is to use a smaller package type for the flash memory. Most of the flash memory components that
can be used with the DLPC900 also come in alternate packages. For example, selecting a BGA package can be
more than 50% smaller compared to a TSOP package.
7.3.5.5.2
Large Density Flash
The second way is to use a larger density flash memory component to combine two or all three flash memory
components into one flash component. However, using this method requires some additional low cost external
logic gates to combine the chip-selects and create and invert signals for the extra address lines. The other
requirement is the flash memory component must contain uniform sectors where each sector is 128
kBytes in size.




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