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DLPC900_V01 Datasheet(Hoja de datos) 69 Page - Texas Instruments

No. de Pieza. DLPC900_V01
Descripción  DLPC900 Digital Controller for Advanced Light Control
Descarga  83 Pages
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Fabricante  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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 69 page
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69
DLPC900
www.ti.com
DLPS037D – OCTOBER 2014 – REVISED MARCH 2019
Product Folder Links: DLPC900
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Copyright © 2014–2019, Texas Instruments Incorporated
10.1.8 DMD Interface Considerations
High-speed interface waveform quality and timing on the DLPC900 controller (that is, the LVDS DMD interface)
is dependent on the following factors:
Total length of the interconnect system
Spacing between traces
Characteristic impedance
Etch losses
How well matched the lengths are across the interface
Thus, ensuring positive timing margin requires attention to many factors.
As an example, DMD interface system timing margin can be calculated as follows:
Setup Margin = (controller output setup) – (DMD input setup) – (PCB routing mismatch) – (PCB SI degradation)
(4)
Hold-time Margin = (controller output hold) – (DMD input hold) – (PCB routing mismatch) – (PCB SI degradation)
(5)
The PCB SI degradation is the signal integrity degradation due to PCB affects which includes such things as
simultaneously switching output (SSO) noise, crosstalk, and intersymbol interference (ISI) noise.
DLPC900 I/O timing parameters, as well as DMD I/O timing parameters, can be easily found in their
corresponding data sheets. Similarly, PCB routing mismatch can be easily budgeted and met via controlled PCB
routing. However, PCB SI degradation is not as easy-to-determine.
In an attempt to minimize the signal integrity analysis that would otherwise be required, the following PCB design
guidelines provide a reference of an interconnect system that satisfies both waveform quality and timing
requirements (accounting for both PCB routing mismatch and PCB SI degradation). Deviation from these
recommendations may work, but should be confirmed with PCB signal integrity analysis or lab measurements.
PCB design: Refer to the Figure 41.
Configuration:
Etch thickness (T):
Flex etch thickness (T):
Single-ended signal impedance:
Differential signal impedance:
Asymmetric dual stripline
1.0-oz copper (1.2 mil)
0.5-oz copper (0.6 mil)
50 Ω (±10%)
100 Ω (±10%)
PCB stackup: Refer to the Figure 41.
Reference plane 1 is assumed to be a ground plane for proper return path.
Reference plane 2 is assumed to be the I/O power plane or ground.
Dielectric FR4, (Er):
4.2 (nominal)
Signal trace distance to reference plane 1 (H1): 5.0 mil (nominal)
Signal trace distance to reference plane 2 (H2): 34.2 mil (nominal)




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