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DLPC900_V01 Datasheet(Hoja de datos) 77 Page - Texas Instruments

No. de Pieza. DLPC900_V01
Descripción  DLPC900 Digital Controller for Advanced Light Control
Descarga  83 Pages
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Fabricante  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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 77 page
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77
DLPC900
www.ti.com
DLPS037D – OCTOBER 2014 – REVISED MARCH 2019
Product Folder Links: DLPC900
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Copyright © 2014–2019, Texas Instruments Incorporated
10.3 Thermal Considerations
The thermal limitation for the DLPC900 is that the maximum operating junction temperature (TJ) must not be
exceeded (this is defined in Recommended Operating Conditions). This temperature is dependent on operating
ambient temperature, airflow, PCB design (including the component layout density and the amount of copper
used), power dissipation of the DLPC900, and power dissipation of surrounding components. The DLPC900
device package is designed primarily to extract heat through the power and ground planes of the PCB, thus
copper content and airflow over the PCB are important factors.
The recommended maximum operating ambient temperature (TA) is provided primarily as a design target and is
based on maximum DLPC900 power dissipation and RθJA at 1 m/s of forced airflow, where RθJA is the thermal
resistance of the package as measured using a JEDEC-defined standard test PCB. This JEDEC test PCB is not
necessarily representative of the DLPC900 PCB, and thus the reported thermal resistance may not be accurate
in the actual product application. Although the actual thermal resistance may be different, it is the best
information available during the design phase to estimate thermal performance. However after the PCB is
designed and the product is built, it is highly recommended thermal performance be measured and validated.
To do this, the top-center case temperature should be measured under the worse case product scenario (max
power dissipation, max voltage, max ambient temp) and validated not to exceed the maximum recommended
case temperature (TC). This specification is based on the measured φJT for the DLPC900 package and provides
a relatively accurate correlation to junction temperature. Care must be taken when measuring this case
temperature to prevent accidental cooling of the package surface. It is recommended to use a small
(approximately 40 gauge) thermocouple. The bead and the thermocouple wire should be covered with a minimal
amount of thermally conductive epoxy and contact the top of the package. The wires should be routed closely
along the package and the board surface to avoid cooling the bead through the wires.




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