4

DAC53401, DAC43401

SLASES7 – JULY 2019

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Product Folder Links: DAC53401 DAC43401

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Copyright © 2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

6

V

–0.3

V

–0.3

1.65

V

–0.3

–0.3

Current into any pin

–10

10

mA

Junction temperature

–40

150

°C

Storage temperature

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±750

Charged device model (CDM), per JEDEC specification JESD22-C101,

±500

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX UNIT

1.71

5.5

V

1.62

V

Digital input low voltage

0.4

V

Ambient temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

DACx3401

UNIT

DSG (WSON)

8 PINS

Junction-to-ambient thermal resistance

49

°C/W

Junction-to-case (top) thermal resistance

50

°C/W

Junction-to-board thermal resistance

24.1

°C/W

Junction-to-top characterization parameter

1.1

°C/W

Junction-to-board characterization parameter

24.1

°C/W

Junction-to-case (bottom) thermal resistance

8.7

°C/W