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MC10H641 Datasheet(PDF) 4 Page - ON Semiconductor

No. de pieza MC10H641
Descripción Electrónicos  SINGLE SUPPLY PECL-TTL 1:9 CLOCK DISTRIBUTION CHIP
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Fabricante Electrónico  ONSEMI [ON Semiconductor]
Página de inicio  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC10H641 Datasheet(HTML) 4 Page - ON Semiconductor

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MC10H641 MC100H641
MOTOROLA
MECL Data
DL122 — Rev 6
2–4
Temperature Dependence
A unique characteristic of the H641 data sheet is that the
AC parameters are specified for a junction temperature rather
than the usual ambient temperature. Because very few
designs will actually utilize the entire commercial temperature
range of a device a tighter propagation delay window can be
established given the smaller temperature range. Because
the junction temperature and not the ambient temperature is
what affects the performance of the device the parameter
limits are specified for junction temperature. In addition the
relationship between the ambient and junction temperature
will vary depending on the frequency, load and board
environment of the application. Since these factors are all
under the control of the user it is impossible to provide
specification limits for every possible application. Therefore a
baseline specification was established for specific junction
temperatures and the information that follows will allow these
to be tailored to specific applications.
Since the junction temperature of a device is difficult to
measure directly, the first requirement is to be able to
“translate” from ambient to junction temperatures. The
standard method of doing this is to use the power dissipation
of the device and the thermal resistance of the package. For
a TTL output device the power dissipation will be a function of
the load capacitance and the frequency of the output. The total
power dissipation of a device can be described by the
following equation:
PD (watts) = ICC (no load) * VCC +
VS * VCC * f * CL * # Outputs
where:
VS= Output Voltage Swing = 3V
f = Output Frequency
CL = Load Capacitance
ICC = IEE + ICCH
Figure 1 plots the ICC versus Frequency of the H641 with
no load capacitance on the output. Using this graph and the
information specific to the application a user can determine
the power dissipation of the H641.
Figure 1. ICC versus f (No Load)
0
1020304050
607080
FREQUENCY (MHz)
0
1
2
3
4
5
Figure 2 illustrates the thermal resistance (in
°C/W) for the
28–lead PLCC under various air flow conditions. By reading
the thermal resistance from the graph and multiplying by the
power dissipation calculated above the junction temperature
increase above ambient of the device can be calculated.
0
200
400
600
800
1000
AIRFLOW (LFPM)
30
40
50
60
70
Figure 2.
∅JA versus Air Flow
Finally taking this value for junction temperature and
applying it to Figure 3 allows the user to determine the
propagation delay for the device in question. A more common
use would be to establish an ambient temperature range for
the H641’s in the system and utilize the above methodology
to determine the potential increased skew of the distribution
network. Note that for this information if the TPD versus
Temperature curve were linear the calculations would not be
required. If the curve were linear over all temperatures a
simple temperature coefficient could be provided.
Figure 3. TPD versus Junction Temperature
–30
JUNCTION TEMPERATURE (
5.2
–10
10
30
50
70
90
110
130
°C)
5.4
5.6
5.8
6.0
6.2
6.4
TPHL
TPLH


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