SL22-MH THRU SL24-MH

(V)

(V)

(V)

(V)

(

SL22-MH

SL22

20

14

20

0.38

SL23-MH

SL23

30

21

30

0.40

SL24-MH

SL24

40

28

40

0.40

SYMBOLS

MARKING

CODE

-55 to +125

Operating

temperature

*1

*2

*3

*4

PARAMETER

CONDITIONS

Symbol

MIN.

TYP.

MAX.

UNIT

Forward rectified current

See Fig.2

2.0

A

Forward surge current

8.3ms single half sine-wave superimposed on

rate load (JEDEC methode)

40

A

25

1.0

mA

10

mA

Thermal resistance

Junction to ambient

70

Diode junction capacitance

f=1MHz and applied 4vDC reverse voltage

160

pF

Storage temperature

-55

+150

Reverse current

*1 Repetitive peak reverse voltage

*2 RMS voltage

*3 Continuous reverse voltage

*4 Maximum forward voltage

Silicon epitaxial planer type

Formosa MS

Low VF Chip Schottky Barrier Diodes

Features

Plastic package has Underwriters Laboratory

Flammability Classification 94V-O Utilizing Flame

Retardant Epoxy Molding Compound.

For surface mounted applications.

Exceeds environmental standards of MIL-S-19500 /

228

Low leakage current.

Mechanical data

Case : Molded plastic, JEDECSOD-123H

Terminals : Solder plated, solderable per MIL-STD-750,

Method 2026

Polarity : Indicated by c athode band

Mounting Position : Any

Weight : 0.0393 gram

0.146(3.7)

0.130(3.3)

0.012(0.3) Typ.

0.071(1.8)

0.055(1.4)

0.035(0.9)

0.028(0.7)

0.031(0.8) Typ.

Dimensions in inches and (millimeters)

SOD-123H

0.031(0.8) Typ.