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TS2940CM5.0 Datasheet(PDF) 4 Page - Taiwan Semiconductor Company, Ltd |
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TS2940CM5.0 Datasheet(HTML) 4 Page - Taiwan Semiconductor Company, Ltd |
4 / 6 page TS2940 4-6 2003/12 rev. B Application Information (continued) The next parameter which must be calculated is the maximum allowable temperature rise, TR(max). this is calculated by the using to formula: TR(max) = TJ(max) – TA(max) Where: TJ(max) is the maximum allowable junction temperature, which is 125 oC for commercial grade parts. TA(max) is the maximum ambient temperature which will be encountered in the application. Using the calculated values for TR(max) and PD, the maximum allowable value for the junction to ambient thermal resistance, θja, can now be found: θja = TR(max) / PD IMPORTANT: if the maximum allowable value for is found to be ≥60 oC/W for the TO-220 package, ≥80 oC/W for the TO-263 package, ≥150 oC/W for the TO-252 package, or ≥170 oC/W for the SOT-223 package, no heatsink is needed since the package alone will dissipate enough heat to satisfy these requirements. If the calculated value for θja falls below these limits, a heatsink is required. |
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