3

Absolute Maximum Ratings

(No Derating Required up to 85

°C)

Storage Temperature ................................................. -55

°C to +125°C

Operating Temperature ............................................... -40

°C to +85°C

(50% duty cycle, 1 ms pulse width)

(

≤1 µs pulse width, 300 pps)

Input Power Dissipation ........................................................... 35 mW

HCPL-M700 ................................................................... -0.5 V to 7 V

HCPL-M701 ................................................................. -0.5 V to 18 V

Output Power Dissipation ....................................................... 100 mW

Infrared and Vapor Phase Reflow Temperature .................. see below

Solder Reflow Thermal Profile

Recommended Pb-Free IR Profile

0

TIME (SECONDS)

200

100

50

150

100

200

250

300

0

30

SEC.

50 SEC.

30

SEC.

160°C

140°C

150°C

PEAK

TEMP.

245°C

PEAK

TEMP.

240°C

PEAK

TEMP.

230°C

SOLDERING

TIME

200°C

PREHEATING TIME

150°C, 90 + 30 SEC.

2.5°C ± 0.5°C/SEC.

3°C + 1°C/–0.5°C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.

Insulation Related Specifications

Parameter

Symbol

Value

Units

Conditions

Min. External Air Gap

L(IO1)

≥5

mm

Measured from input terminals

(Clearance)

to output terminals

Min. External Tracking Path

L(IO2)

≥5

mm

Measured from input terminals

(Creepage)

to output terminals

Min. Internal Plastic Gap

0.08

mm

Through insulation distance

(Clearance)

conductor to conductor

Tracking Resistance

CTI

175

V

DIN IEC 112/VDE 0303 Part 1

Isolation Group (per DIN VDE 0109)

IIIa

Material Group DIN VDE 0109

217 °C

RAMP-DOWN

6 °C/SEC. MAX.

RAMP-UP

3 °C/SEC. MAX.

150 - 200 °C

260 +0/-5 °C

t 25 °C to PEAK

60 to 150 SEC.

20-40 SEC.

TIME WITHIN 5 °C of ACTUAL

PEAK TEMPERATURE

PREHEAT

60 to 180 SEC.

25

TIME

NOTES:

THE TIME FROM 25 °C to PEAK

TEMPERATURE = 8 MINUTES MAX.