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TPPM0110DWPR Datasheet(PDF) 9 Page - Texas Instruments

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No. de pieza TPPM0110DWPR
Descripción Electrónicos  DUAL LOW-DROPOUT LINEAR REGULATOR
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
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TPPM0110DWPR Datasheet(HTML) 9 Page - Texas Instruments

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TPPM0110
DUAL LOW-DROPOUT LINEAR REGULATOR
SLVS365 –MARCH 2001
9
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TYPICAL THERMAL CHARACTERISTICS
To ensure reliable operation of the device, the junction temperature of the output device must be within the safe
operating area (SOA). This is achieved by providing a means to dissipate the heat generated from the junction
of the output structure. There are two components that contribute to thermal resistance. They consist of two
paths in series. The first is the junction-to-case thermal resistance, RθJC; the second is the case-to-ambient
thermal resistance, RθCA. The overall junction-to-ambient thermal resistance, RθJA, is determined by:
RθJA = RθJC + RθCA
The ability to efficiently dissipate the heat from the junction is a function of the package style and board layout
incorporated in the application. The operating junction temperature is determined by the operating ambient
temperature, TA, and the junction power dissipation, PJ.
The junction temperature, TJ, is determined by the following thermal equation:
TJ = TA + PJ (RθJC) + PJ (RθCA)
TJ = TA + PJ (RθJA)
This particular application uses the 20-pin DWP power pad package with a standard lead frame with a dedicated
ground terminal. Using a multilayer printed-circuit board (PCB), the power pad is mounted as recommended
in the TI packaging application. The power pad is electrically connected to the ground plane of the board through
a dedicated ground pin and the die mount power pad. This provides a means for heat spreading through the
copper plane associated within the PCB (ground layer). The thermal resistance from junction to ambient, RθJA,
is dependent of several factors, the implemented method of package attachment to the heat spreading material
and the air flow in the system application.


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