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FMM5820X Datasheet(PDF) 10 Page - Eudyna Devices Inc |
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FMM5820X Datasheet(HTML) 10 Page - Eudyna Devices Inc |
10 / 13 page 10 Ka-Band Power Amplifier MMIC FMM5820X ■ ■ ■ ■ Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters) 0 0 4225 2620 2620 0 0 4225 1310 1310 105 105 135 135 2515 2515 2485 2485 275 275 825 825 1685 1685 2345 2345 3875 3875 Chip Size : 4225± ± ± ± 30um x 2620± ± ± ± 30um Chip Thickness : 60± ± ± ± 20um Bonding Pad Size : 160um x 80um (VGG2) VDD2 VDD4 VDD6 VDD8 VGG1 VDD1 VDD3 VDD5 VDD7 NOTE: Gate voltage is required from either or both bonding pad( VGG1 or/and VGG2). |
Número de pieza similar - FMM5820X |
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Descripción similar - FMM5820X |
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