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SIDC09D60E6

 Fast switching diode chip in EMCON-Technology ( 4 Page)


INFINEON
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SIDC09D60E6
Edited by INFINEON Technologies AI PS DD CLS, L 4303M, Edition 2,
20.07.04
Maximum Ratings
Parameter
Symbol
Condition
Value
Unit
Repetitive peak reverse voltage
V RRM
600
V
Continuous forward current limited by
Tjmax
I F
20
Single pulse forward current
(depending on wire bond configuration)
I FSM
tP = 10 ms sinusoidal
Tj = 25°C
80
Maximum repetitive forward current
limited by Tjmax
I FRM
60
A
Operating junction and storage
temperature
Tj , Tstg
-55...+150
°C
Static Electrical Characteristics (tested on chip), Tj=25 °C, unless otherwise specified
Value
Parameter
Symbol
Conditions
min.
Typ.
max.
Unit
Reverse leakage current
I R
V R=600V
Tj=25 ° C
27
µA
Cathode-Anode
breakdown Voltage
V Br
I R=3mA
Tj=25°C
600
V
Forward voltage drop
V F
I F=20A
Tj=25 ° C
-
1.25
1.7
V
Dynamic Electrical Characteristics, at Tj = 25 °C, unless otherwise specified, tested at component
Value
Parameter
Symbol
Conditions
min.
Typ.
max.
Unit
t rr1
Tj =25°C
150
Reverse recovery time
t rr2
IF=20A
di/dt=700A/
µs
VR=400V
Tj =125°C
200
ns
I RRM1
Tj =25°C
20
Peak recovery current
I RRM2
IF=20A
di/dt=900A/
µs
VR= 300V
Tj =125°C
25
A
Qrr1
Tj=25 ° C
1.7
Reverse recovery charge
Qrr2
IF=20A
di/dt=900A/
µs
VR= 300V
Tj=125 ° C
2.7
µC
1  2  3  4 



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