SIDC73D170E6 datasheet(4/4 Pages) INFINEON | Fast switching diode chip in EMCON-Technology

4 page

Preliminary

SIDC73D170E6

Edited by INFINEON Technologies AI PS DD HV3, L4381M, Edition 1, 28.02.02

FURTHER ELECTRICAL CHARACTERISTICS:

This chip data sheet refers to the

device data sheet

INFINEON TECHNOLOGIES /

EUPEC

tbd

Description:

AQL 0,65 for visual inspection according to failure catalog

Electrostatic Discharge Sensitive Device according to MIL-STD 883

Test-Normen Villach/Prüffeld

Published by

Infineon Technologies AG

Bereich Kommunikation

St.-Martin-Strasse 53

D-81541 München

Attention please!

The information herein is given to describe certain components and shall not be considered as warranted

characteristics.

Terms of delivery and rights to technical change reserved.

We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,

regarding circuits, descriptions and charts stated herein.

Infineon Technologies is an approved CECC manufacturer.

Information

For further information on technology, delivery terms and conditions and prices please contact your nearest

Infineon Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see

address list).

Warnings

Due to technical requirements components may contain dangerous substances. For information on the types

in question please contact your nearest Infineon Technologies Office.

Infineon Technologies components may only be used in life-support devices or systems with the express

written approval of Infineon Technologies, if a failure of such components can reasonably be expected to

cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or

system. Life support devices or systems are intended to be implanted in the human body, or to support

and / or maintain and sustain and / or protect human life. If they fail, it is reasonable to assume that the

health of the user or other persons may be endangered.

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