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SIDC73D170E6

 Fast switching diode chip in EMCON-Technology ( 4 Page)


INFINEON
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Preliminary
SIDC73D170E6
Edited by INFINEON Technologies AI PS DD HV3, L4381M, Edition 1, 28.02.02
Maximum Ratings
Parameter
Symbol
Condition
Value
Unit
Repetitive peak reverse voltage
V RRM
1700
V
Continuous forward current limited by
Tjmax
I F
100
Single pulse forward current
(depending on wire bond configuration)
I FSM
tP = 10 ms sinusoidal
tbd
Maximum repetitive forward current
limited by Tjmax
I FRM
200
A
Operating junction and storage
temperature
Tj , Tstg
-55...+150
°C
Static Electrical Characteristics (tested on chip), Tj=25 °C, unless otherwise specified
Value
Parameter
Symbol
Conditions
min.
Typ.
max.
Unit
Reverse leakage current
I R
V R=1700V
Tj=25 ° C
27
µA
Cathode-Anode
breakdown Voltage
V Br
I R=4mA
Tj=25°C
1700
V
Forward voltage drop
V F
I F=100A
Tj=25 ° C
2.15
V
Dynamic Electrical Characteristics, at Tj = 25 °C, unless otherwise specified, tested at component
Value
Parameter
Symbol
Conditions
min.
Typ.
max.
Unit
t rr1
IF=100A
Tj = 25 °C
tbd
Reverse recovery time
t rr2
di/dt=1700A/
µs
VR=900V
Tj = 150 °C
ns
I RRM1
Tj = 25 °C
110
Peak recovery current
I RRM2
IF=100A
di/dt=1700A/
µs
VR=900V
Tj = 150 °C
130
A
Qrr1
Tj=25 ° C
35
Reverse recovery charge
Qrr2
IF=100A
di/dt=1700A/
µs
VR=900V
Tj=150 ° C
60
µC
dirr1/dt
Tj= 25 ° C
tbd
Peak rate of fall of reverse
recovery current
dirr2/dt
IF=100A
di/dt=1700A/
µs
VR=900V
Tj=150 ° C
A/
µs
S1
Tj=25 ° C
tbd
Softness
S2
IF=100A
di/dt=1700A/
µs
VR=900V
Tj=150 ° C
1
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