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74LVC07APW Datasheet(PDF) 9 Page - NXP Semiconductors |
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74LVC07APW Datasheet(HTML) 9 Page - NXP Semiconductors |
9 / 16 page 2000 Mar 07 9 Philips Semiconductors Product specification Hex buffer with open-drain outputs 74LVC07A PACKAGE OUTLINES UNIT A max. A1 A2 A3 bp cD(1) E(1) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.0 0.4 SOT108-1 X w M θ A A1 A2 b p D HE L p Q detail X E Z e c L v M A (A ) 3 A 7 8 1 14 y 076E06 MS-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.050 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 97-05-22 99-12-27 0 2.5 5 mm scale SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 |
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