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ADF4252BCP-REEL7 Datasheet(PDF) 4 Page - Analog Devices |
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ADF4252BCP-REEL7 Datasheet(HTML) 4 Page - Analog Devices |
4 / 28 page REV. B –4– ADF4252 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADF4252 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ORDERING GUIDE Temperature Package Mode Range Option * ADF4252BCP –40ºC to +85ºC CP-24 ADF4252BCP-REEL –40ºC to +85ºC CP-24 ADF4252BCP-REEL7 –40ºC to +85ºC CP-24 EVAL–ADF4252EB1 EVAL–ADF4252EB2 *CP = Chip Scale Package PIN CONFIGURATION PIN 1 INDICATOR TOP VIEW (Not to Scale) 18 CPGND2 17 DVDD 16 IFINA 15 IFINB CPRF 1 CPGND1 2 RFINA 3 14 AGND2 13 RSET RFINB 4 AGND1 5 MUXOUT 6 ADF4252 ABSOLUTE MAXIMUM RATINGS 1, 2 (TA = 25 °C, unless otherwise noted.) VDD1, VDD2, VDD3, DVDD to GND 3 . . . . . . . . –0.3 V to +4 V REFIN, RFINA, RFINB to GND . . . . . . –0.3 V to VDD + 0.3 V VP1, VP2 to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.8 V VP1, VP2 to VDD1 . . . . . . . . . . . . . . . . . . . . . –3.3 V to +3.5 V Digital I/O Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V Analog I/O Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Maximum Junction Temperature . . . . . . . . . . . . . . . . . 150 °C CSP JA Thermal Impedance . . . . . . . . . . . . . . . . . . . 122 °C/W Soldering Reflow Temperature Vapor Phase (60 sec max) . . . . . . . . . . . . . . . . . . . . . 240 °C IR Reflow (20 sec max) . . . . . . . . . . . . . . . . . . . . . . . 240 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2This device is a high performance RF integrated circuit with an ESD rating of <2 k Ω, and it is ESD sensitive. Proper precautions should be taken for handling and assembly. 3GND = CP GND1, AGND1, DGND, AGND2, and CPGND2. |
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