www.ti.com

5

4

7

3

8

1

2

2

BOOT

UGATE

PHASE

LGATE

GND

1

8

5

4

6 VDD

EN/PG

7

PWM

3

2

BOOT

UGATE

PHASE

LGATE

GND

1

8

5

4

6 VDD

EN/PG

7

PWM

3

VIN

PWM 4

GND

VOUT

PWM1

8

PWM3

Enable

PWM2

ToDriver

ToDriver

GNDS

ToController

CSCN

CS 4

ToController

CS 1

TPS28225

TPS28225

TPS28225

SLUS710 – MAY 2006

TYPICAL APPLICATIONS (continued)

Multi-Phase Synchronous Buck Converter

PACKAGE

TAPE AND REEL QTY.

PART NUMBER

Plastic 8-pin SOIC (D)

250

TPS28225DT

Plastic 8-pin SOIC (D)

2500

TPS28225DR

-40°C to 125°C

Plastic 8-pin DFN (DRB)

250

TPS28225DRBT

Plastic 8-pin DFN (DRB)

3000

TPS28225DRBR

(1)

SOIC-8 (D) and DFN-8 (DRB) packages are available taped and reeled. Add T suffix to device type (e.g. TPS28225DT) to order taped

devices and suffix R to device type to order reeled devices.

(2)

The SOIC-8 (D) and DFN-8 (DRB) package uses in Pb-Free lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255°C to

260°C peak reflow temperature to be compatible with either lead free or Sn/Pb soldering operations.

(3)

In the DFN package, the pad underneath the center of the device is a thermal substrate. The PCB “thermal land” design for this

exposed die pad should include thermal vias that drop down and connect to one or more buried copper plane(s). This combination of

vias for vertical heat escape and buried planes for heat spreading allows the DFN to achieve its full thermal potential. This pad should

be either grounded for best noise immunity, and it should not be connected to other nodes.

4

Submit Documentation Feedback