NUD4301

http://onsemi.com

6

PACKAGE DIMENSIONS

DFN8

CASE 506AQ−01

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994 .

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.25 AND 0.30 MM FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

5. INTERNAL PAD SIZE: 1.5 X 0.9 MM.

A

D

E

B

C

0.10

PIN ONE

2 X

REFERENCE

2 X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

A

L

(A3)

D2

E2

C

C

0.10

C

0.10

C

0.08

8 X

A1

SEATING

PLANE

e/2

e

8 X

K

NOTE 3

b

8 X

0.10 C

0.05 C

A BB

DIM

MIN

MAX

MILLIMETERS

A

0.80

1.00

A1

0.00

0.05

A3

0.20 REF

b

0.20

0.30

D

2.00 BSC

D2

1.10

1.30

E

2.00 BSC

E2

0.50

0.70

e

0.50 BSC

K

0.20

−−−

L

0.25

0.45

1

4

8

5

NOTE 5

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

mm

inches

SCALE 15:1

1.350

0.0531

1.150

0.0453

0.575

0.0226

0.500

0.0197

PITCH

0.700

0.0276

0.300

0.0118

0.250

0.0098

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