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www.ti.com ABSOLUTE MAXIMUM RATINGS DISSIPATION RATINGS (1) RECOMMENDED OPERATING CONDITIONS SLOS492A – MAY 2006 – REVISED MAY 2006 over operating free-air temperature (unless otherwise noted) (1) VALUE UNIT VDD Supply voltage –0.3 to 3.6 V DATA, LRCLK, BCLK, SCL, SDA –0.3 to 5.5 V VI Input voltage ADD[2:0] –0.3 to VDD+0.3 Continuous total power dissipation See Dissipation Rating Table TA Operating free-air temperature range –40 to 85 °C TJ Operating junction temperature range –40 to 125 °C Tstg Storage temperature range –65 to 125 °C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. PACKAGE TA≤ 25°C DERATING TA = 70°C TA = 85°C POWER RATING FACTOR POWER RATING POWER RATING RSA 2.5 W 25mW/ °C 1.375 W 1.0 W (1) This data was taken using 1 oz trace and copper pad that is soldered directly to a JEDEC standard high-k PCB. The thermal pad must be soldered to a thermal land on the printed-circuit board. See TI Technical Briefs SCBA017D and SLUA271 for more information about using the QFN thermal pad. MIN MAX UNIT VDD Supply voltage VDD 3 3.6 V VIH High-level input voltage DATA, LRCLK, BCLK, SCL, SDA, ADD[2:0] 2 V VIL Low-level input voltage DATA, LRCLK, BCLK, SCL, SDA, ADD[2:0] 0.8 V TA Operating free-air temperature –40 85 °C 3 |
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