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AD5821D-WAFER Datasheet(PDF) 5 Page - Analog Devices

No. de pieza AD5821D-WAFER
Descripción Electrónicos  120 mA, Current Sinking, 10-Bit, I2C DAC
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
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AD5821D-WAFER Datasheet(HTML) 5 Page - Analog Devices

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AD5821
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
Rating
VDD to AGND
–0.3 V to +5.5 V
VDD to DGND
–0.3 V to VDD + 0.3 V
AGND to DGND
–0.3 V to +0.3 V
SCL, SDA to DGND
–0.3 V to VDD + 0.3 V
XSHUTDOWN to DGND
–0.3 V to VDD + 0.3 V
ISINK to AGND
–0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (B Version)
−30°C to +85°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature (TJ MAX)
150°C
WLFCSP Power Dissipation
(TJ MAX − TA)/θJA
θJA Thermal Impedance1
Mounted on 4-Layer Board
95°C/W
Lead Temperature, Soldering
Maximum Peak Reflow Temperature2
260°C (±5°C)
1 To achieve the optimum θJA, it is recommended that the AD5821
be soldered on a 4-layer board.
2 As per JEDEC J-STD-020C.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION


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