DAN222

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4

PACKAGE DIMENSIONS

SC−75/SOT−416

CASE 463−01

ISSUE F

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

M

0.20 (0.008)

D

−E−

−D−

b

e

3 PL

0.20 (0.008) E

C

L

A

A1

3

2

1

STYLE 3:

PIN 1. ANODE

2. ANODE

3. CATHODE

DIM

MIN

NOM

MAX

MILLIMETERS

A

0.70

0.80

0.90

A1

0.00

0.05

0.10

b

C

0.10

0.15

0.25

D

1.55

1.60

1.65

E

e

1.00 BSC

0.027

0.031

0.035

0.000

0.002

0.004

0.004

0.006

0.010

0.059

0.063

0.067

0.04 BSC

MIN

NOM

MAX

INCHES

0.15

0.20

0.30

0.006

0.008

0.012

L

0.10

0.15

0.20

1.50

1.60

1.70

0.004

0.006

0.008

0.061

0.063

0.065

0.70

0.80

0.90

0.027

0.031

0.035

0.787

0.031

0.508

0.020

1.000

0.039

mm

inches

SCALE 10:1

0.356

0.014

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

1.803

0.071

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