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LM2931T-5.0G Datasheet(PDF) 3 Page - ON Semiconductor |
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LM2931T-5.0G Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 23 page LM2931, NCV2931 Series http://onsemi.com 3 MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage Continuous VI 40 Vdc Transient Input Voltage ( t ≤ 100 ms) VI(t) 60 Vpk Transient Reverse Polarity Input Voltage −VI(t) −50− Vpk 1.0% Duty Cycle, t ≤ 100 ms Electrostatic Discharge Sensitivity (ESD) Human Body Model (HBM) Class 2, JESD22 A114−C Machine Model (MM) Class A, JESD22 A115−A Charged Device Model (CDM), JESD22 C101−C − − − 2000 200 2000 V V V Power Dissipation Case 29 (TO−92 Type) TA = 25°C PD Internally Limited W Thermal Resistance, Junction−to−Ambient RqJA 178 °C/W Thermal Resistance, Junction−to−Case RqJC 83 °C/W Case 221A, 314A, 314B and 314D (TO−220 Type) TA = 25°C PD Internally Limited W Thermal Resistance, Junction−to−Ambient RqJA 65 °C/W Thermal Resistance, Junction−to−Case RqJC 5.0 °C/W Case 318H (SOT−223) TA = 25°C PD Internally Limited W Thermal Resistance, Junction−to−Ambient RqJA 242 °C/W Thermal Resistance, Junction−to−Case RqJC 21 °C/W Case 369A (DPAK) (Note 1) TA = 25°C PD Internally Limited W Thermal Resistance, Junction−to−Ambient RqJA 92 °C/W Thermal Resistance, Junction−to−Case RqJC 6.0 °C/W Case 751 (SOP−8) (Note 2) TA = 25°C PD Internally Limited W Thermal Resistance, Junction−to−Ambient RqJA 160 °C/W Thermal Resistance, Junction−to−Case RqJC 25 °C/W Case 936 and 936A (D2PAK) (Note 3) TA = 25°C PD Internally Limited W Thermal Resistance, Junction−to−Ambient RqJA 70 °C/W Thermal Resistance, Junction−to−Case RqJC 5.0 °C/W Operating Ambient Temperature Range TA −40 to +125 °C Operating Die Junction Temperature TJ +150 °C Storage Temperature Range Tstg −65 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. DPAK Junction−to−Ambient Thermal Resistance is for vertical mounting. Refer to Figure 25 for board mounted Thermal Resistance. 2. SOP−8 Junction−to−Ambient Thermal Resistance is for minimum recommended pad size. Refer to Figure 24 for Thermal Resistance variation versus pad size. 3. D2PAK Junction−to−Ambient Thermal Resistance is for vertical mounting. Refer to Figure 26 for board mounted Thermal Resistance. |
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