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SN65MLVD047_06

 MULTIPOINT-LVDS QUAD DIFFERENTIAL LINE DRIVER ( 17 Page)


TI
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PACKAGE DISSIPATION RATINGS
ABSOLUTE MAXIMUM RATINGS
SN65MLVD047
SLLS606A – MARCH 2004 – REVISED JULY 2005
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PART NUMBER
PACKAGE MARKING
PACKAGE/CARRIER
SN65MLVD047D
MLVD047
16-Pin SOIC/Tube
SN65MLVD047DR
MLVD047
16-Pin SOIC/Tape and Reel
SN65MLVD047PW
MLVD047
16-Pin TSSOP/Tube
SN65MLVD047PWR
MLVD047
16-Pin TSSOP/Tape and Reel
PCB JEDEC
TA ≤ 25°C
DERATING FACTOR
TA = 85°C
PACKAGE
STANDARD
POWER RATING
ABOVE TA = 25°C(1)
POWER RATING
D(16)
Low-K(2)
898 mW
7.81 mW/
°C
429 mW
Low-K(2)
592 mW
5.15 mW/
°C
283 mw
PW(16)
High-K(3)
945 mW
8.22 mW/
°C
452 mw
(1)
This is the inverse of the junction-to-ambient thermal resistance when board mounted and with no air flow.
(2)
In accordance with the Low-K thermal metric definitions of EIA/JESD51-3.
(3)
In accordance with the High-K thermal metric definitions of EIA/JESD51-7.
over operating free-air temperature range unless otherwise noted(1)
UNITS
VCC
Supply voltage range(2)
–0.5 V to 4 V
VI
Input voltage range
A, EN, EN
–0.5 V to 4 V
VO
Output voltage range
Y, Z
–1.8 V to 4 V
Y and Z
±9 kV
Human Body Model(3)
All pins
±4 kV
Electrostatic discharge
Charged-Device Model(4)
All pins
±1500 V
Machine Model(5)
All pins
200 V
TJ
Junction temperature
140
°C
PD
Continuous power dissipation
See Dissipation Rating Table
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values, except differential I/O bus voltages, are with respect to the circuit ground terminal.
(3)
Tested in accordance with JEDEC Standard 22, Test Method A114-B.
(4)
Tested in accordance with JEDEC Standard 22, Test Method C101-A.
(5)
Tested in accordance with JEDEC Standard 22, Test Method A115-A.
2
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