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www.ti.com PACKAGE DISSIPATION RATINGS ABSOLUTE MAXIMUM RATINGS SN65MLVD047 SLLS606A – MARCH 2004 – REVISED JULY 2005 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION PART NUMBER PACKAGE MARKING PACKAGE/CARRIER SN65MLVD047D MLVD047 16-Pin SOIC/Tube SN65MLVD047DR MLVD047 16-Pin SOIC/Tape and Reel SN65MLVD047PW MLVD047 16-Pin TSSOP/Tube SN65MLVD047PWR MLVD047 16-Pin TSSOP/Tape and Reel PCB JEDEC TA ≤ 25°C DERATING FACTOR TA = 85°C PACKAGE STANDARD POWER RATING ABOVE TA = 25°C(1) POWER RATING D(16) Low-K(2) 898 mW 7.81 mW/ °C 429 mW Low-K(2) 592 mW 5.15 mW/ °C 283 mw PW(16) High-K(3) 945 mW 8.22 mW/ °C 452 mw (1) This is the inverse of the junction-to-ambient thermal resistance when board mounted and with no air flow. (2) In accordance with the Low-K thermal metric definitions of EIA/JESD51-3. (3) In accordance with the High-K thermal metric definitions of EIA/JESD51-7. over operating free-air temperature range unless otherwise noted(1) UNITS VCC Supply voltage range(2) –0.5 V to 4 V VI Input voltage range A, EN, EN –0.5 V to 4 V VO Output voltage range Y, Z –1.8 V to 4 V Y and Z ±9 kV Human Body Model(3) All pins ±4 kV Electrostatic discharge Charged-Device Model(4) All pins ±1500 V Machine Model(5) All pins 200 V TJ Junction temperature 140 °C PD Continuous power dissipation See Dissipation Rating Table (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential I/O bus voltages, are with respect to the circuit ground terminal. (3) Tested in accordance with JEDEC Standard 22, Test Method A114-B. (4) Tested in accordance with JEDEC Standard 22, Test Method C101-A. (5) Tested in accordance with JEDEC Standard 22, Test Method A115-A. 2 |
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