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www.ti.com TRUTH TABLE (1) EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS 7 V 7 V 300 k Ω 300 k Ω Input Input VCC 50 Ω 300 k Ω VCC 7 V EN,EN 5 Ω VCC 7 V Output ABSOLUTE MAXIMUM RATINGS SLLS451B – SEPTEMBER 2000 – REVISED SEPTEMBER 2002 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DIFFERENTIAL INPUT ENABLES OUTPUT RIN+– RIN– EN EN ROUT VID ≥ 100 mV H L or VID ≤ –100 mV H L OPEN Open/short or terminated H X All other conditions Z (1) H = high level, L = low level, X = irrelevant, Z = high impedance (off) over operating free-air temperature range (unless otherwise noted)(1)(2) UNIT VCC Supply voltage range –0.3 V to 4 V VI(RIN+, Input voltage range –0.3 V to 4 V RIN-) Enable input voltage (EN, EN ) –0.3 V to (VCC +0.3 V) VO(ROUT) Output voltage –0.3 V to (VCC +0.3 V) Bus-pin (RIN+, RIN–) electrostatic discharge(3) > 10 kV Continuous power dissipation See Dissipation Rating Table Storage temperature range –65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. (3) Tested in accordance with MIL-STD-883C Method 3015.7. 2 |
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