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BYD147 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BYD147 Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 8 page 1999 Nov 11 3 Philips Semiconductors Product specification Ultra fast low-loss rectifier BYD147 THERMAL CHARACTERISTICS Note 1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.7. For more information please refer to the “General part of the associated handbook”. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-tp thermal resistance from junction to tie-point 30 K/W Rth j-a thermal resistance from junction to ambient note 1 150 K/W |
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