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BYG70 Datasheet(PDF) 4 Page - NXP Semiconductors |
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BYG70 Datasheet(HTML) 4 Page - NXP Semiconductors |
4 / 6 page 1996 Jun 05 4 Philips Semiconductors Preliminary specification Fast soft-recovery controlled avalanche rectifiers BYG70 series GRAPHICAL DATA Fig.2 Maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage). VR =VRRMmax; δ = 0.5; a = 1.57. handbook, halfpage 0 200 2.0 IF(AV) (A) 1.5 0.5 0 1.0 MGD485 100 Ttp (°C) Fig.3 Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage). VR =VRRMmax; δ = 0.5; a = 1.57. Device mounted as shown in Fig.7; solid line: Al2O3 PCB; dotted line: epoxy PCB. handbook, halfpage 0 200 0.8 IF(AV) (A) 0.6 0.2 0 0.4 MGD486 100 Tamb (°C) Device mounted as shown in Fig.7. Solid line: Al2O3 PCB. Dotted line: epoxy PCB. Fig.4 Maximum permissible junction temperature as a function of reverse voltage. handbook, halfpage 200 Tj ( °C) 0 400 0 MGD487 800 VR (V) 40 DG J 80 120 160 Solid line: Tj =25 °C. Dotted line: Tj = 175 °C. Fig.5 Forward current as a function of forward voltage; maximum values. handbook, halfpage 0 246 VF (V) 8 5 IF (A) 0 4 MGD488 3 2 1 |
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Descripción similar - BYG70 |
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