5

SY89223L

Micrel, Inc.

M9999-051805

hbwhelp@micrel.com or (408) 955-1690

8 LEAD ULTRA-SMALL EPAD-

MicroLeadFrame™ (MLF-8)

Package

EP- Exposed Pad

Die

CompSide Island

Heat Dissipation

Heavy Copper Plane

Heavy Copper Plane

Heat Dissipation

PCB Thermal Consideration for 8-Pin MLF™ Package

(Always solder, or equivalent, the exposed pad to the PCB)

Package Notes:

Note 1.

Package meets level two qualification.

Note 2.

All parts are dry-packaged before shipment.

Note 3.

Exposed pads must be soldered to a ground plane, of the same potential as the device GND

pin, for proper thermal management.

MICREL, INC.

2180 FORTUNE DRIVE

SAN JOSE, CA 95131

USA

TEL

The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.

Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.

Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can

reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into

the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s

use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify

Micrel for any damages resulting from such use or sale.

© 2005 Micrel, Incorporated.