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©2004 Fairchild Semiconductor Corporation Rev. A, June 2004 Thermal Characteristics T a=25°C unless otherwise noted * Device mounted on FR-4 PCB 400mm × 40mm × 1.5mm Symbol Parameter Max. Units PD Total Device Dissipation Derate above 25 °C 350 2.8 mW mW/ °C RθJA Thermal Resistance, Junction to Ambient 357 °C/W |
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