Specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Tel: +44 (0) 1325 301111

Fax: +44 (0) 1325 306177

FMA3008

Preliminary Datasheet v2.1

4

It is recommended that the RF connections be made using two bond wires 25µm in diameter and a

maximum length of 300µm. Optimum input and output return loss can be achieved, to compensate for

bond wire length, with the addition of a microstrip transformer, shown in the diagram below.

Substrate: Alumina

Thickness: 635µm

Dimensions in mm

Transformer Impedance 36

Ω

Electrical Length 21º at 10GHz

All RF tracks should be 50

Ω characteristic material

Capacitor, 100pF, chip capacitor

Capacitor, 100pF, 0402

Optional Circuit for

external cascade Gate

Control

RF Output

100pF

VDD

VG1

100pF

nF

100nF

RF Input

VG2

100nF

100pF

100

To Evaluation Board via an 0402

Surface Mounted capacitor

0.61

0.61

100pF Chip

Capacitor

100pF Chip

Capacitors

0.65

1.1

1.1

0.65

To Evaluation Board via an 0402

Surface Mounted capacitor