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AM29PL320DT30WPI Datasheet(PDF) 5 Page - Advanced Micro Devices

No. de pieza AM29PL320DT30WPI
Descripción Electrónicos  32 Megabit (2 M x 16-Bit/1 M x 32-Bit) CMOS 3.0 Volt-only High Performance Page Mode Flash Memory
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Fabricante Electrónico  AMD [Advanced Micro Devices]
Página de inicio  http://www.amd.com
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AM29PL320DT30WPI Datasheet(HTML) 5 Page - Advanced Micro Devices

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June 13, 2005
Am29PL320D
3
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Input Configuration . . . . . . . . . . . . . . . . . . . . . . . . 7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8
Standard Products .................................................................... 8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 9
Table 1. Am29PL320D Device Bus Operations ................................9
Word/Double Word Configuration ............................................. 9
Requirements for Reading Array Data ..................................... 9
Read Mode ............................................................................... 9
Random Read (Non-Page Mode Read) ............................................9
Page Mode Read .................................................................... 10
Table 2. Double Word Mode ...........................................................10
Table 3. Word Mode ........................................................................10
Writing Commands/Command Sequences ............................ 11
Accelerated Program Operation ......................................................11
Program and Erase Operation Status .................................... 11
Standby Mode ........................................................................ 11
Automatic Sleep Mode ........................................................... 11
Output Disable Mode .............................................................. 11
Table 4. Sector Address Table, Top Boot (Am29PL320DT) ...........12
Table 5. SecSi
™ Sector Addresses for Top Boot Devices .............12
Table 6. Sector Address Table, Bottom Boot (Am29PL320DB) ......13
Table 7. SecSi
™ Sector Addresses for
Bottom Boot Devices .......................................................................13
Autoselect Mode ..................................................................... 14
Table 8. Am29PL320D Autoselect Codes (High Voltage Method) ..14
Sector Protection/Unprotection ............................................... 14
Common Flash Memory Interface (CFI) . . . . . . . 15
Table 9. CFI Query Identification String ..........................................15
Table 10. System Interface String ...................................................16
Table 11. Device Geometry Definition ............................................16
Table 12. Primary Vendor-Specific Extended Query ......................17
SecSi
™ (Secured Silicon) Sector Flash Memory Region ....... 18
Factory Locked: SecSi Sector Programmed and
Protected At the Factory .................................................................18
Customer Lockable: SecSi Sector NOT Programmed or Locked
At the Factory .................................................................................18
Figure 1. SecSi Sector Protect Verify.............................................. 19
Write Protect (WP#) ................................................................ 19
Hardware Data Protection ...................................................... 19
Low VCC Write Inhibit ......................................................................19
Write Pulse “Glitch” Protection ........................................................19
Logical Inhibit ..................................................................................19
Power-Up Write Inhibit ....................................................................19
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 19
Reading Array Data ................................................................ 19
Reset Command ..................................................................... 20
Autoselect Command Sequence ............................................ 20
Enter SecSi
™ Sector/Exit SecSi Sector
Command Sequence .............................................................. 20
Word/Double Word Program Command Sequence ............... 20
Unlock Bypass Command Sequence ..............................................21
Figure 2. Program Operation .......................................................... 21
Chip Erase Command Sequence ........................................... 22
Sector Erase Command Sequence ........................................ 22
Erase Suspend/Erase Resume Commands ........................... 22
Figure 3. Erase Operation.............................................................. 23
Temporary Sector Unprotect Enable/Disable
Command Sequence .............................................................. 24
Figure 4. Temporary Sector Unprotect Algorithm .......................... 24
Command Definitions ............................................................. 25
Table 13. Command Definitions (Double Word Mode) .................. 25
Table 14. Command Definitions (Word Mode) ............................... 26
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 27
DQ7: Data# Polling ................................................................. 27
Figure 5. Data# Polling Algorithm .................................................. 27
DQ6: Toggle Bit ...................................................................... 28
DQ2: Toggle Bit ...................................................................... 28
Reading Toggle Bits DQ6/DQ2 ............................................... 28
DQ5: Exceeded Timing Limits ................................................ 28
Figure 6. Toggle Bit Algorithm........................................................ 29
DQ3: Sector Erase Timer ....................................................... 29
Table 15. Write Operation Status ................................................... 30
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 31
Figure 7. Maximum Negative Overshoot Waveform ...................... 31
Figure 8. Maximum Positive Overshoot Waveform........................ 31
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 31
Commercial (C) Devices ......................................................... 31
Industrial (I) Devices ............................................................... 31
VCC Supply Voltages .............................................................. 31
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 32
CMOS Compatible .................................................................. 32
Zero Power Flash ................................................................... 33
Figure 9. ICC1 Current vs. Time (Showing Active and Automatic Sleep
Currents) ........................................................................................ 33
Figure 10. Typical ICC1 vs. Frequency ........................................... 33
Figure 11. Test Setup..................................................................... 34
Table 16. Test Specifications ......................................................... 34
Key to Switching Waveforms. . . . . . . . . . . . . . . . 34
Figure 12. Input Waveforms and Measurement Levels ................. 34
Read Operations .................................................................... 35
Figure 13. Conventional Read Operations Timings ....................... 36
Figure 14. Page Read Timings ...................................................... 36
Double Word/Word Configuration (WORD#) ........................ 37
Figure 15. WORD# Timings for Read Operations.......................... 37
Figure 16. WORD# Timings for Write Operations.......................... 37
Program/Erase Operations .................................................... 38
Figure 17. Program Operation Timings.......................................... 39
Figure 18. AC Waveforms for Chip/Sector Erase Operations........ 40
Figure 19. Data# Polling Timings (During Embedded Algorithms). 40
Figure 20. Toggle Bit Timings (During Embedded Algorithms)...... 41
Figure 21. DQ2 vs. DQ6 for Erase and
Erase Suspend Operations ............................................................ 41
Alternate CE# Controlled
Erase/Program Operations ..................................................... 42
Figure 22. Alternate CE# Controlled Write Operation Timings ...... 43
Erase and Programming Performance . . . . . . . 44
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
BGA Package Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 46
FBF084—84-Ball Fine Pitch Ball Grid Array (FBGA) 11 x 12 mm ..... 46
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 47
Revision A (March 7, 2001) .................................................... 47


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