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ISL59448IAZ-T7 Datasheet(PDF) 9 Page - Intersil Corporation |
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ISL59448IAZ-T7 Datasheet(HTML) 9 Page - Intersil Corporation |
9 / 14 page 9 FN6160.2 March 29, 2006 FIGURE 25. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FIGURE 26. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Typical Performance Curves VS = ±5V, RL = 500Ω to GND, TA = 25°C, unless otherwise specified. (Continued) JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD - QFN EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5 1.2 1 0.8 0.6 0.4 0.2 0 0 255075 100 150 AMBIENT TEMPERATURE (°C) 125 85 θJA=88°C/W QSOP24 1.136W JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 1.2 1 0.8 0.6 0.4 0.2 0 0 25 50 75 100 150 AMBIENT TEMPERATURE (°C) 125 85 θJA=115°C/W QSOP24 870mW ISL59448 |
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