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MC34713EP Datasheet(PDF) 5 Page - Freescale Semiconductor, Inc |
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MC34713EP Datasheet(HTML) 5 Page - Freescale Semiconductor, Inc |
5 / 21 page Analog Integrated Circuit Device Data Freescale Semiconductor 5 34713 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS THERMAL RESISTANCE (7) Thermal Resistance, Junction to Ambient, Single-Layer Board (1s) (8) RθJA 139 °C/W Thermal Resistance, Junction to Ambient, Four-Layer Board (2s2p) (9) RθJMA 43 °C/W Thermal Resistance, Junction to Board (10) RθJB 22 °C/W Notes 7. The PVIN, SW, and PGND pins comprise the main heat conduction paths. 8. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal. 9. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. There are no thermal vias connecting the package to the two planes in the board. 10. Thermal resistance between the device and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. Table 2. Maximum Ratings (continued) All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit |
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