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4 page 
SPEC NO: DSAD0957 REV NO: V.1 DATE: MAR/22/2003 PAGE: 4 OF 4 APPROVED : J. Lu CHECKED :Allen Liu DRAWN: S.J.HOU Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) APTC2012SYC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. |
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