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TDA1308 Datasheet(PDF) 1 Page - NXP Semiconductors |
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TDA1308 Datasheet(HTML) 1 Page - NXP Semiconductors |
1 / 12 page August 1994 2 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 FEATURES • Wide temperature range • No switch ON/OFF clicks • Excellent power supply ripple rejection • Low power consumption • Short-circuit resistant • High performance – high signal-to-noise ratio – high slew rate – low distortion • Large output voltage swing. GENERAL DESCRIPTION The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has been primarily developed for portable digital audio applications. QUICK REFERENCE DATA VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified. Note 1. VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB). ORDERING INFORMATION SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VDD supply voltage single 3.0 5.0 7.0 V dual 1.5 2.5 3.5 V VSS negative supply voltage −1.5 −2.5 −3.5 V IDD supply current no load − 3 5 mA Ptot total power dissipation no load − 15 25 mW Po maximum output power THD < 0.1%; note 1 − 60 − mW (THD + N)/S total harmonic distortion plus noise-to-signal ratio note 1 − 0.03 0.06 % − −70 −65 dB RL = 5 kΩ − −101 − dB S/N signal-to-noise ratio 100 110 − dB α cs channel separation − 70 − dB RL = 5 kΩ − 105 − dB PSRR power supply ripple rejection fi = 100 Hz; Vripple(p-p) = 100 mV − 90 − dB Tamb operating ambient temperature −40 − +85 °C TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION TDA1308 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 TDA1308T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 |
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