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TDA1308 Datasheet(PDF) 1 Page - NXP Semiconductors

No. de pieza TDA1308
Descripción Electrónicos  Class AB stereo headphone driver
Download  12 Pages
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Fabricante Electrónico  PHILIPS [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TDA1308 Datasheet(HTML) 1 Page - NXP Semiconductors

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August 1994
2
Philips Semiconductors
Product specification
Class AB stereo headphone driver
TDA1308
FEATURES
• Wide temperature range
• No switch ON/OFF clicks
• Excellent power supply ripple rejection
• Low power consumption
• Short-circuit resistant
• High performance
– high signal-to-noise ratio
– high slew rate
– low distortion
• Large output voltage swing.
GENERAL DESCRIPTION
The TDA1308 is an integrated class AB stereo headphone
driver contained in an SO8 or a DIP8 plastic package. The
device is fabricated in a 1 mm CMOS process and has
been primarily developed for portable digital audio
applications.
QUICK REFERENCE DATA
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
Note
1. VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB).
ORDERING INFORMATION
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDD
supply voltage
single
3.0
5.0
7.0
V
dual
1.5
2.5
3.5
V
VSS
negative supply voltage
−1.5
−2.5
−3.5
V
IDD
supply current
no load
3
5
mA
Ptot
total power dissipation
no load
15
25
mW
Po
maximum output power
THD < 0.1%; note 1
60
mW
(THD + N)/S
total harmonic distortion plus
noise-to-signal ratio
note 1
0.03
0.06
%
−70
−65
dB
RL = 5 kΩ
−101
dB
S/N
signal-to-noise ratio
100
110
dB
α
cs
channel separation
70
dB
RL = 5 kΩ
105
dB
PSRR
power supply ripple rejection fi = 100 Hz; Vripple(p-p) = 100 mV
90
dB
Tamb
operating ambient
temperature
−40
+85
°C
TYPE NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA1308
DIP8
plastic dual in-line package; 8 leads (300 mil)
SOT97-1
TDA1308T
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1


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